Optoelectronic Packaging

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40-Pin Optical Communication Package Tube Shell

Unit Price: 111USD

Brand: XL

Infrared detector housings are essential for protecting both uncooled and cooled infrared focal plane detectors. These housings are widely used in various industries such as infrared night vision, security, firefighting, maritime operations,...
Optical communication encapsulation shell gold finger

Unit Price: 35USD

Brand: XL

Infrared detector housings are essential for protecting both uncooled and cooled infrared focal plane detectors. These housings are widely used in various industries such as infrared night vision, security, firefighting, maritime operations,...
8-Pin Optical Communication Enclosure

Unit Price: 35USD

Brand: XL

Optical Communication Housings and Electronics Packaging Infrared detector housings play a critical role in safeguarding both uncooled and cooled infrared focal plane detectors. These housings find widespread applications in areas such as infrared...
Metallized Ceramics for Electronic Applications

Unit Price: 45USD

Brand: XL

Infrared detector housings are essential for protecting both uncooled and cooled infrared focal plane detectors. These housings have a wide range of applications in fields such as infrared night vision, security, firefighting, maritime operations,...
Butterfly Shell 10PIN Electronics Package

Unit Price: USD 50 / Piece/Pieces

Min.Order Unit Price
34 Piece/Pieces USD 50 / Piece/Pieces

Butterfly housings are a kind of common pipe connectors, usually used to connect two pipes or between pipes and equipment, with a special butterfly-shaped structure, hence the name. Butterfly housings are usually made of metal materials (e.g....
Electronic Ceramics for Communication

Unit Price: 45USD

Brand: XL

Optical Communication Device Housing for Metal Wall - Ceramic Insulator Structure Our optical communication device housings are specifically designed to meet the requirements of providing an electrical signal transmission channel and an optical...
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Optic Electronic Communication Device Packages and Substrates
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